This is the July 2023 edition of the neXt Curve Tech Insights newsletter. This edition covers SEMICON West 2023, Qualcomm HQ tour of ControlNet and Sony Honda Mobility’s Afeela, Snapdragon Sound at The Village Studios, and Samsung Galaxy Unpacked Fold and more. Subscribe for tech and industry insights that matter.
Continue readingThis is the June 2023 edition of the neXt Curve Tech Insights newsletter. This edition covers WWDC 2023, Sensors Converge, HPE Discover, Samsung Networks Analyst Day, Cisco Live, Honeywell HBT HUG, hybrid AI, GenAI, 5G modernization, RedCap, Galaxy Book3 and S23 Ultra, and more. Subscribe for tech and industry insights that matter.
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neXt Curve’s key takes and insights from GSMA’s Mobile World Congress MWC 2023 with a focus on Open RAN, semiconductors, telco cloud and more.
Continue readingJanuary 2023 edition of neXt Curve’s monthly newsletter on tech and industry trends and happenings that matter.
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The CHIPS and Science Act of 2022, signed Tuesday by President Biden, includes the stated purpose of challenging China’s pursuit of technological and manufacturing leadership in the global semiconductor industry. The bill easily passed both the Senate (64-33) and the House (243-187) with bipartisan support in both houses.
While the passage of the CHIPS Act is a historic achievement that directly addresses the need for chip supply chain resilience add capacity in the U.S., it is also a timely and important commitment to a much longer and comprehensive policy effort to ensure long-term U.S. technology and market share leadership in the vital semiconductor industry.
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event featured the heavyweights in the semiconductor industry on the main stage of IAA Mobility, most notably, Cristano Amon, CEO of Qualcomm and Pat Gelsinger, CEO of Intel. Both business leaders presented back-to-back keynotes that offered common and divergent perspectives on the role of silicon and connectivity in the future of the car. Collectively, Cristano and Pat outlined an ambitious future for the car founded on the projection of digital technologies of the data center and smartphone on the automobile.
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The semiconductor industry is the foundation of our digital world. Everything runs on semiconductor products and continues to advance with each new process node. As we reach the physical limits of Moore’s Law, what comes next? Heterogenous computing and heterogenous packaging are opening up new possibilities for progressing Moore’s Law through advancements in the way that we design, integrate semiconductor devices and systems.
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5G, AI, and the cloud are intersecting to unlock real-time autonomous capabilities at the edge. This evolution represents an inflection point for edge computing and a new frontier for business innovation and reinvention. Discover the potential of ubiquitous intelligence, edge cloud computing, and autonomous infrastructure to transform our world from the age of digital business to autonomous enterprise.
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On 8/14/2018, Intel revealed another security flaw has been exposed called “Foreshadow”, whereby a botnet could bypass the safeguards and create a “shadow copy” at an unprotected location of the computer’s CPU rendering Intel’s security measures inert.
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Meltdown and Spectre represent a new class of security threat that endangers our digital world at its core – the processor. What do enterprises need to do to protect their digital businesses and their customers from Meltdown and Spectre exploits in a Privacy First world with GDPR enforced?
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