CHIPS Act: The Leading Edge Gap

With $52.7 billion slated for grants to support Sections 9902 through 9906 of the 2021 National Defense Appropriations Act (NDAA), Washington faces daunting next steps to define and execute on a CHIPS Act program to move the U.S. semiconductor industry toward domestic chip supply chain resiliency and manufacturing and technology leadership over the next five years.

With the growing tensions across the Taiwan Strait, the timeline for achieving domestic supply chain resiliency seems to be increasingly urgent. This is especially true for leading-edge manufacturing as the U.S. continues to trail  Asia. There are nontrivial risks that need to be addressed for Washington’s near- and long-term promises for the CHIPS Act to be realized.

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CHIPS Act: A Vital First Step

The CHIPS and Science Act of 2022, signed Tuesday by President Biden, includes the stated purpose of challenging China’s pursuit of technological and manufacturing leadership in the global semiconductor industry. The bill easily passed both the Senate (64-33) and the House (243-187) with bipartisan support in both houses.

While the passage of the CHIPS Act is a historic achievement that directly addresses the need for chip supply chain resilience add capacity in the U.S., it is also a timely and important commitment to a much longer and comprehensive policy effort to ensure long-term U.S. technology and market share leadership in the vital semiconductor industry.

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The US-China Tech War: Technology and Digital Economic Leadership at the Crossroads

Last week, the US Senate passed the USICA (The United States Innovation and Competition Act) which includes the CHIPS for America Act. Despite what the title of the USICA and its sub articles might suggest, the policy is largely a manifesto for dealing with a rising and highly competitive China with particular concern for the Western rival’s ambition to achieve semiconductor self-sufficiency and Huawei’s ascension as the leading 5G technology vendor. The Act presents several concrete policy measures to diminish China’s access to US semiconductor technologies and 52 billion USD in federal funding to build a more resilient semiconductor supply chain. But will these policies help the US achieve what the title of the USICA suggest; improve US semiconductor supply chain resiliency and competitiveness in 5G? Will it stop the technological advancement of China and its digital economy long enough for the West to tame it? 

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Huawei Annual Report 2020: A Year of Survival

neXt Curve was in Nice, France attending the premier global event for digital transformation in the telecommunications industry held from May 14th through May 16th and hosted by TM Forum.  Leading vendors and operators converged to discuss what it will take help the telecom industry reinvent itself and aid telecom service providers in becoming digital service providers.  Now that 5G has arrived in select markets around the globe, the pressure is on for telecom operators to transform their operating models to capture the value promised by the next generation network.

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Tech Insight: Heterogenous Computing

The semiconductor industry is the foundation of our digital world. Everything runs on semiconductor products and continues to advance with each new process node. As we reach the physical limits of Moore’s Law, what comes next? Heterogenous computing and heterogenous packaging are opening up new possibilities for progressing Moore’s Law through advancements in the way that we design, integrate semiconductor devices and systems.

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Industry Insight: The Unintended Consequence of the US War on Huawei

The US Department of Commerce recently amended its foreign-produced direct product rule (FPDP) and Entity List to include HiSilicon, Huawei’s semiconductor design subsidiary. This action has been widely deemed an escalation of the US government’s “war on Huawei. In the broader context of the US sanction on Chinese tech firms, the addendum applies a consistency of “national security and foreign policy purpose” to HiSilicon.

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Industry Insight: China’s Trade “Win-Win” and the Phase 2 Trade Deal

While the White House has touted a major victory in the trade war with China with the signing of a so-called “Phase One” deal, it was difficult not to notice the very visible absence of Chinese President Xi Jinping himself. Instead, the Trump Administration received a congratulatory letter from President Trump’s Chinese counterpart read by Vice Premier Liu He, a level-three member of the Chinese Politburo.

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Living on The Edge: Why is Edge Compute So Confusing?

As the IoT and 5G have evolved the models have moved from a simple Sensor to Gateway, to Cloud, to Edge, to near Edge, to Mobile Edge hype and perhaps one to two more terms that are circulating out there in the hype cycle. The terminology is confusing and typically is market speak or used to hype a specific technology and location between the Cloud and endpoint device that will be used for the majority of the collection, compute, response, and storage of the data.

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CES 2019: Key Takeaways

neXt Curve attended the largest consumer electronics trade show on the planet with over 180,000 in attendance to identify the deeper technology and market trends that are driving the rapid evolution of our digital lives and are expressed in the new digitally-enabled consumer applications from smart home, 3D sound to emotionally-aware robots.

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Tech Insight: Apple’s Not-So-Slow-Moving Coup of The Personal Computing World

While industry sages prognosticated the diminishing relevance of the tablet device category for the past three years as iPad and tablet sales slowed, Apple quietly amassed an installed base of over 400 million active iPads thanks to extended iOS device support. The newly announced iPad Pro is poised to bring about an inflection point in personal computing by changing the way we think of portable computing.

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